CVE-2017-18323

2019-01-0315:00:00

qualcomm

www.cve.org

AI Score

5.7

Confidence

High

EPSS

Percentile

12.6%

JSON

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.

CNA Affected

[
  {
    "product": "Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear",
    "vendor": "Qualcomm, Inc.",
    "versions": [
      {
        "status": "affected",
        "version": "MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130"
      }
    ]
  }
]

References

www.securityfocus.com/bid/106128

www.qualcomm.com/company/product-security/bulletins